Two standards — Bunch of Wires (BoW) and UCIe — compete with proprietary designs. Today, the latter predominates, since ...

Chiplets will be a key enabler for customizing designs at every level, from edge devices to the cloud. AI is a key driver, ...

Chiplets offer a huge leap in semiconductor functionality and productivity, just like soft IP did 40 years ago, but a lot has ...

Chip smuggling; AI export controls; Middle East AI deals; DeepSeek's new report; OSAT revenue up; AI PC memory chipsets; big ...

Structural and Thermal Aware Methodology for Placement in 2.5D Integration” was published by researchers at Pennsylvania ...

Supply chain vulnerabilities, hardware attacks, and communications hacks are rife. Autonomous technology poses extra threats.

High-voltage PCB spacing; HBM4; AI changes engineering teams; ion beam etching; wafer market and raw materials.

A new technical paper titled “Hardware vs. Software Implementation of Warp-Level Features in Vortex RISC-V GPU” was published ...

Rooting out the causes of silent data corruption errors will require testing improvements and much more. Silent data errors ...

A new technical paper titled “Key Safety Design Overview in AI-driven Autonomous Vehicles” was published by researchers at ...