Fabless semiconductor startup Mindgrove launches India's first indigenously designed commercial high-performance MCU chip; Renesas Introduces Industry's First General-Purpose 32-bit RISC-V MCUs with Internally Developed CPU Core

Srujan joins Kandou AI with a distinguished background in technology leadership and innovation. SANTA CLARA, UNITED STATES – April 8, 2025 --Kandou AI, previously Kandou, is pleased to announce the appointment of Srujan Linga as Chief Executive Officer (CEO) for the company’s next stage of growth.Kandou AI Founder Amin Shokrollahi, who served as the company’s CEO, has transitioned to ...

Apr 10, 2025 · HSINCHU, Taiwan, R.O.C. – Apr. 10, 2025 - TSMC (TWSE: 2330, NYSE: TSM) today announced its net revenue for March 2025: On a consolidated basis, revenue for March 2025 was approximately NT$285.96 billion, an increase of 10.0 percent from February 2025 and an increase of 46.5 percent from March 2024. Revenue for January through March 2025 totaled NT$839.25 billion, an increase of 41.6 percent ...

Apr 17, 2025 · Kaiserslautern, Germany – April 17, 2025 – Creonic, the leading provider of high-performance IP cores for ASIC and FPGA technologies, has unveiled a bold new brand identity, reaffirming its commitment to delivering cutting-edge signal processing solutions that power global communication technologies.. A Bold New Look for the Future. The redesigned logo reflects Creonic’s mission of ...

Lightweight Root-of-Trust. Rapidly implement secure boot and attestation capabilities without significant area, cost, or complexity overhead. Prevent malicious software attacks, unauthorized access, and firmware tampering to safeguard critical device functionality.

Apr 2, 2025 · LONDON (United Kingdom) and TORONTO (Ontario, Canada) – April 2, 2025 – The Board of Alphawave notes the announcement by Qualcomm on 1 April 2025 and will provide an update if and when appropriate.Alphawave is confident in its strategy to become a leading semiconductor company and the value this will deliver for shareholders.

Mar 28, 2025 · ReRAM-Powered Edge AI: A Game-Changer for Energy Efficiency, Cost, and Security Weebit Nano Blog - Eran Briman, Weebit Nano Mar. 28, 2025

A placement bound is a constraint that controls the placement of groups of leaf cells and hierarchical cells. It allows us to group the cells and minimize the wire length. It helps us to place the cells at the most appropriate location.

The DiFi IP core is a highly scalable and silicon agnostic implementation of the IEEE-ISTO Std 4900-2021: Digital IF Interoperability Standard v1.2.1 targeting ASIC, and FPGA technologies. The DiFi implementation builds on long-time experience designing IP cores for sending and receiving Radio IQ ...

Apr 15, 2025 · Achieving ultra-low latency and pristine image quality in ST 2110 production with JPEG XS integration. Mont-Saint-Guibert, Belgium – April 15, 2025 - intoPIX, the leading provider of lightweight low-latency compression technologies, announces that JPEG XS technology is now embedded into Doteck’s latest R8 and R4 Series of ST 2110 UHD encoder solutions, delivering ultra-low latency and ...